High Volume Selective Dip Soldering
The HSS 3235 is ideal to solder leaded components or connectors. This applies specifically when short cycle times are required for large volume production.
Both, bare boards as well as carriers can be processed and, of course, the HSS 3235 may be integrated into a fully automated production line.
Depending on the size of PCB to be soldered, the HSS 3235 feeds one or more assemblies into the different machine areas: fluxer, preheating or soldering area. In each case, all joints will be fluxed, preheated or soldered in parallel and at the same time which guarantees shortest cycle times.