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Vi er medlem af brancheportalen Electronic Supply, der er målrettet elektronikbranchen i Danmark.

ASSCON

Firmaet ASSCON Systemtechnik-Elektronik GmbH blev grundlagt i 1995 for udvikling og produktion af forening for progressive og innovative Damp fase flydelodning systemer.
  • Quicky-300
    The machine is impressive due its simplicity, ease of use and through providing the ability to solder high quality assemblies defectfree and the small dimensions of the machine and its independence of fixed supply systems, makes the unit easy to use at different workplaces without restrictions.
  • VP-450-Vapor-Phase
    Soldering Machine for Laboratory and Single Piece Production Machine Design The machine is impressive due its simplicity, ease of use and through providing the ability to solder high quality assemblies defectfree. The automatic measuring cycle recognizes the medium used. A closed cooling system is integrated in the base of the machine.
  • VP-800-Vapor-Phase
    Soldering System for Laboratories, Prototyping and Close-to-Production Process Qualifications. Machine Design The ASSCON VP800 system has been developed especially for laboratories and prototyping. Thanks to ist multi-chamber design, the system can also be used for implementing close-to-production process qualifications. Moreover, the system can be used for soldering very small series. As the processing zone, it is possible to apply the soldering process in the VP800 system to the standard achieved by current production lines in a compact environment. Here the system especially stands out of its simple handling, enabling each user to solder high-quality modules fault-free.
  • VP-800-Vapor-Phase-Vacuum
    Soldering System for Laboratories, Prototyping and Close-to-Production Process Qualifications.

    ASSCON vapour-phase reflow soldering systems are state-of-the art. They are the innovative response to modern soldering challenges. The physical principles of the process allow fault-free soldering of the most complex SMT modules in lead-free soldering pastes in virtually any arrangement. ASSCON's vacuum soldering process combines the advantages of the vapourphase with the vacuum process. Power components require a homogeneous metallic connection with the PCB to transfer the required current. Assemblies soldered in ASSCON's vacuum process exhibit greatly improved solder joints relative to void formation. Particularly when using lead-free solders the wetting properties decrease and the solder joints exhibit an increased occurrence of voids and entrapments.
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